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| Hall IC LT261A 2.90.2 1.9 2 0.4 3 0.4 0.95 X 4-R0.2 Hall device center line X : +0.050.23mm against package center Y : -0.050.1mm against package lead center between No.2 and No.3 terminals Z : 0.810.15mm from package surface Terminal connections 1.50.2 0.6 0.6 REG Hall + device H 0.3 1.1-0.1 0.16+0.10 -0.06 s Applications FDD HDD Water meter Car stereo Microswitch, etc. 0.8 +0.2 - (0to0.15) s Absolute Maximum Ratings Parameter Supply voltage Output voltage Output current Power dissipation Operating temperature Storage temperature Soldering temperature*1 *1 Soldering time : within 10 seconds *No.3 terminal and the section of leads (both sides of package in X direction) are connected with the terminal of internal IC. Be careful in connecting other circuits. 1 : VCC 2 : VOUT 3 : Don't use. 4 : GND (Ta=25C) Unit V V mA mW C C C Symbol Rating VCC 18 18 VOUT 5 IO 100 PD -20 to +125 Topr -55 to +150 Tstg 260 Tsol As for dimensions of tape-packaged products, refer to page 44 . s Operating Explanation Output voltage BRP 0 BOP +B Magnetic flux density s Electrical Characteristics Parameter Operating magnetic flux density Hysteresis breadth Operating voltage Supply current Low level output voltage High level output voltage Output short circuit current Operating point temperature drift Symbol BOP BRP BH VCC ICC VOL VOH IOS BOP Conditions VCC=16V VOO=16V VCC=16V, B=<-10mT VCC=16V, IO=4mA, B>=10mT VCC=16V, IO=-100A, B=<-10mT VCC=16V VCC=16V, Ta=-20C to +80C MIN. -10 4.5 13.9 -1.55 -6 TYP. MAX. 10 5 16 10.5 0.4 -0.80 6 (Ta=25C) Unit mT mT mT V mA V V mA mT In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device spcification sheets before using any SHARP device. 2.90.2 *Zero-cross is not warranted. s Features Operation by small magnet due to high sensitivity s Outline Demensions (Unit : Fmm) Operating point<10mT 2.70.3 Combining a GaAs Hall device and an IC in a compact Y package (2.9X1.5X1.1mm) 1 4 Wide operation temperature range obtained by GaAs Hall device (-20 to +125C) Long life time due to noncontact-type S Z 0.4 0.6 0.85 LT261A GaAs Hall IC for Noncontact Switch (Alternating magnetic field-type*) Hall IC Fig. 1 Operating magnetic flux density B (mT) LT261A Operating Magnetic Flux Density vs. Supply Voltage Ta=25C Fig. 2 Operating magnetic flux density B (mT) 12 8 4 0 -4 -8 -12 Operating Magnetic Flux Density vs. Ambient Temperature VCC=16V 12 8 4 0 -4 -8 -12 0 BOP BRP BOP BRP 4 8 12 16 Supply voltage VCC (V) 20 -40 0 40 80 120 Ambient temperature Ta (C) Fig. 3 10 8 6 4 2 Supply Current vs. Supply Voltage B=<-10mT Ta=25C Fig. 4 10 8 6 4 2 Supply Current vs. Ambient Temperature VCC=16V B=<-10mT Supply current ICC (mA) Supply current ICC (mA) 0 0 4 8 12 16 Supply voltage VCC (V) 20 0 -40 0 40 80 120 Ambient temperature Ta (C) Fig. 5 1.0 Low level output voltage VOL (V) Low Level Output Voltage vs. Output Current VCC=16V B>=10mT Ta=25C Fig. 6 1.0 Low Level Output Voltage vs. Ambient Temperature VCC=16V IO=4mA B>=10mT Low level output voltage VOL (V) 0.8 0.6 0.4 0.2 0.8 0.6 0.4 0.2 0 0 1 2 3 4 Output current IO (mA) 5 0 -40 0 40 80 120 Ambient temperature Ta (C) |
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